Memory
Non-volatile and volatile memory, one line card
Code storage · data logging · system DRAM — industrial & automotive grades, long lifecycle
From boot NOR and mass-storage NAND/eMMC to DDR3L and LPDDR4X main memory — with −40 °C to +85/105/125 °C grades and a broad footprint choice (WSON, USON, WLCSP, FBGA, BGA) for space-constrained and second-source designs.
| Technology | Density | Voltage | Speed | Temp grade | Packages |
|---|---|---|---|---|---|
| Serial NAND (SPI) | 512 Mb – 8 Gb | 1.8 / 3.3 V | to 120 MHz | −40...+125 °C | WSON · BGA · LGA |
| Serial NOR (SPI) | 64 Mb – 2 Gb | 1.8 / 3.3 V | to 166 MHz | −40...+125 °C | SOP · WSON · USON · WLCSP · FBGA |
| Parallel NAND | 1 Gb – 16 Gb | 1.8 / 3.3 V | 20 – 45 ns | −40...+105 °C | TSOP · FBGA |
| eMMC | 64 GB – 128 GB | 3.3 V | HS400 | −40...+105 °C | BGA (153-ball) |
| DDR3 / DDR3L | 2 Gb – 4 Gb | 1.35 / 1.5 V | 1066 MHz | −40...+95 °C | FBGA |
| LPDDR4X | 1 Gb – 8 Gb | 1.1 V | 1600 – 2133 MHz | −40...+85 °C | FBGA |
Industrial by default
−40 °C to +85/105/125 °C grades across the serial and parallel families for demanding environments.
Compact & drop-in
Broad footprint choice — WSON, USON, WLCSP, FBGA, BGA — for space-constrained and second-source designs.
System coverage
Boot NOR and mass-storage NAND / eMMC through to DDR3L and LPDDR4X main memory on one line card.
Representative Families
DSSMI (SPI NAND) – FMS2M / D5SM (SPI NOR) – FMND (parallel NAND) – DSSSE (eMMC) – FRS (DDR3 / DDR3L) – FSE (LPDDR4X)
